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YNV12T05 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 5 A
and horizontal converter mounting. The airflow
The following pages contain specific plots or
waveforms associated with the converter. Additional
comments for specific data are provided below.
Test Conditions
All data presented were taken with the converter
soldered to a test board, specifically a 0.060” thick
printed wiring board (PWB) with four layers. The top
and bottom layers were not metalized. The two inner
layers, comprised of two-ounce copper, were used to
provide traces for connectivity to the converter.
The lack of metalization on the outer layers as well
as the limited thermal connection ensured that heat
transfer from the converter to the PWB was
minimized. This provides a worst-case but consistent
scenario for thermal derating purposes.
All measurements requiring airflow were made in the
vertical and horizontal wind tunnels using Infrared
(IR) thermography and thermocouples for
thermometry.
Ensuring components on the converter do not
exceed their ratings is important to maintaining high
reliability. If one anticipates operating the converter
at or close to the maximum loads specified in the
derating curves, it is prudent to check actual
operating temperatures in the application.
Thermographic imaging is preferable; if this
capability is not available, then thermocouples may
be used. The use of AWG #40 gauge thermocouples
is recommended to ensure measurement accuracy.
Careful routing of the thermocouple leads will further
minimize measurement error. Refer to Fig. C for
optimum measuring thermocouple location.
during the testing is parallel to the long axis of the
converter, going from input pins to output pins.
For each set of conditions, the maximum load
current is defined as the lowest of:
(i) The output current at which any MOSFET
temperature does not exceed a maximum
specified temperature (120 °C) as indicated by the
thermographic image, or
(ii) The maximum current rating of the converter (5A)
During normal operation, derating curves with
maximum FET temperature less than or equal to
120 °C should not be exceeded. Temperature on the
PCB at the thermocouple location shown in Fig. C
should not exceed 120 °C in order to operate inside
the derating curves.
Efficiency
Figure x.3 shows the efficiency vs. load current plot
for ambient temperature of 25 oC, airflow rate of
200 LFM (1 m/s) and input voltages of 9.6 V, 12 V,
and 14 V.
Power Dissipation
Fig. x.4 shows the power dissipation vs. load current
plot for Ta = 25 oC, airflow rate of 200 LFM (1 m/s)
with vertical mounting and input voltages of 9.6 V,
12 V, and 14 V.
Ripple and Noise
The output voltage ripple waveform is measured at
full rated load current. Note that all output voltage
waveforms are measured across a 1 ? F ceramic
capacitor.
The output voltage ripple and input reflected ripple
current waveforms are obtained using the test setup
shown in Fig. D.
i S
Fig. C: Location of the thermocouple for thermal testing .
Thermal Derating
1 ? H
source
inductance
V source
C IN
4 x 47 ? F
ceramic
capacitor
Vin
Y-Series
DC/DC
Converter
Vout
1 ? F
ceramic
capacitor
C O
47 ? F
ceramic
capacitor
Vout
Load current vs. ambient temperature and airflow
rates are given in Figs. x.1 to x.2 for maximum
GND
GND
temperature of 120 °C. Ambient temperature was
varied between 25 °C and 85 °C, with airflow rates
from 30 to 500 LFM (0.15 to 2.5 m/s), and vertical
Fig. D: Test Set-up for measuring input reflected ripple
currents, i s and output voltage ripple.
MCD10201 Rev. 1.0, 24-Jun-10
Page 7 of 26
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